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Dataset associated with "Terahertz Dielectric Property Characterization of Photopolymers for Additive Manufacturing"

Duangrit, Nattapong and Hong, Binbin and Andrew, Burnett and Prayoot, Akkaraeakthalin and Robertson, Ian D. and Somjit, Nutapong (2018) Dataset associated with "Terahertz Dielectric Property Characterization of Photopolymers for Additive Manufacturing". University of Leeds. [Dataset]

Dataset description

Figures and source data for the paper '0.2 – 1.4-THz Dielectric Property Characterization of Photopolymers for Additive Manufacturing': In this paper, resin-based photocurable polymer materials for stereolithography (SLA), digital-light-processing (DLP) and polymer-jetting (PolyJet) additive manufacturing techniques were characterized from 0.2 – 1.4 terahertz (THz) for their comprehensive dielectric properties, e.g. reflective index, absorption coefficient, dielectric constant and loss tangent, by using laser-based time-domain spectroscopy (TDS). Fourteen photocurable 3D-printing polymers were chosen due to their suitability, in terms of printing resolution, material characteristics and etc., for millimeter-wave (mm-wave) and THz applications. The propagation loss mechanism and other electrical/optical properties of the chosen photopolymers for terahertz radiation were determined by correlating absorption coefficients and loss tangents obtained from the measurements. To demonstrate the utilization of the selected photopolymers at THz spectrum, an asymptotically quasi-single-mode Bragg fiber microfabricated by DLP micromanufacturing technique using HTM140-V2 photopolymer was prototyped and characterized at the nominal frequencies from 0.246 to 0.276 THz. The measurement results show that the average propagation loss of the asymptotically single-mode THz Bragg fiber is less than 5dB/m for the whole band, which is the lowest propagation loss reported to date for asymptotically single-mode all-dielectric fiber at this frequency band.

Divisions: Faculty of Engineering and Physical Sciences > School of Electronic and Electrical Engineering
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License: Creative Commons Attribution 4.0 International (CC BY 4.0)
Date deposited: 20 Feb 2019 13:39



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